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LPR (Low-Pressure Removal)

WINTEL'S PRODUCTS

Comparison of PR removal ability

PR Removal Data Comparison

  • Wintel LPR shows higher removal rate for all type of ashing processes.
  • Especially Wintel LPR shows excellent performance in low O2 and no O2 removal processes.
U.HA Plasma Source
U.HA Plasma Source
  • Normal ashing process with unique plasma source is possible.
  • In particular, excellent results can be
    obtained from low O2 & No O2 processes.
  • Low pressure process favors particle reduction
    (Fume reduced)
  • Low pressure & low Temperature  Excellent performance
    (Low -P & low –T mask removal)