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LPR (Low-Pressure Removal)
PE ALD
Poly Etcher
HARC
Doped ACL
EER
EUV
HARC (High Aspect Ratio Contact) Cleaning
WINTEL'S PRODUCTS
LPR (Low-Pressure Removal)
PE ALD
Poly Etcher
HARC
Doped ACL
EER
EUV
Test Pattern TEM Image
Test Pattern TEM Image
Aspect Ratio possible for contact cleaning ＞ 50:1
Removable sub-layer Materials : Oxidized
tungsten and poly silicon
Side wall loss <1Å (SiO
2
, Si
3
N
4
)
